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Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

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Suntek Electronics Co., Ltd.
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City:changsha
Province/State:hunan
Country/Region:china
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Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

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Brand Name :Suntek Electronics Co., Ltd
Model Number :2024-PCBA-128
Certification :ISO9001 ISO13485 IATF16949 UL
Place of Origin :China or Cambodia
MOQ :1pcs
Price :Customized products
Payment Terms :TT,Paypal
Delivery Time :5-7days after all components kitted
Packaging Details :By ESD bags and carton
Layer :4 Layers
Impedance control :Yes
Surface Finish :Lead Free HASL
Copper :1OZ
Warranty :1 year
X-RAY inspection :For BGA,OFN,QFP with bottom pads
Material :FR4
LW/LS min. :0.05mm
Thickness :0.4mm-3mm
silkscreen color :white,black
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Communication PCB Assembly Rigid PCB 2-40 Layers and Rigid-Flex PCB 1-10 Layers for Advanced Downstream Application Field

Suntek Contract Factory:

Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC

assembly,Cable assembly,Mix technology assembly and Box-buildings.

Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;

BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.

Capabilities overview:

Product Name PCB Assembly
PCBA Test AOI, X-RAY, ICT, Function Test
PCB Assembly Method BGA
Minimum Hole Tolerance ±0.05mm
Layers 2-10
PCB Thickness 0.2-7.0mm
Surface Finish HASL, ENIG, OSP, Immersion Silver, Immersion Tin
PCB Process Immersion Gold
PCB Quality System ROHS
Min. Line Width/Spacing 0.1mm
Surface Finish ENIG

Communication is the most important downstream application field of PCB. PCB has a wide range of applications in various aspects such as wireless network, transmission network, data communication and fixed network broadband, and it is usually added value such as backplane, high-frequency high-speed board, and multi-layer PCB board. Higher product. 5G is the next generation mobile communication network, and there will be a large amount of infrastructure construction demand by then, which is expected to greatly boost the demand for communication boards.

Here are the most common applications of the telecommunication industry that make efficient use of PCBs:

  • Wireless communication systems
  • Mobile phone tower systems
  • Telephonic switching systems
  • PBX systems
  • Industrial wireless communication technology
  • Technology for commercial phones
  • Video conferencing technologies
  • Communication technology used in space
  • Cell transmission and tower electronics
  • High speed servers and routers
  • Electronic data storage devices
  • Mobile communication systems
  • Satellite systems and communication devices
  • Video collaboration systems
  • Land wired communication systems
  • Technology for commercial phones
  • Digital and analog broadcasting systems
  • Voice over Internet Protocol (VoIP)
  • Signal boost systems (online)
  • Security technology and information communication systems

Why is FR-4 still commonly used if industrial PCBs face extreme temperatures?

While special substrates like polyimides and ceramics handle wider temperature swings, FR-4 laminates have evolved “high Tg” versions usable to 150°C+ along with lower cost and better fabricator familiarity. So FR-4 remains an option for many industrial applications not hitting extreme temps.

Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application FieldCommunication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application FieldCommunication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application FieldCommunication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application FieldCommunication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application FieldCommunication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application FieldCommunication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

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