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Communication PCB Assembly Rigid PCB 2-40 Layers and Rigid-Flex PCB 1-10 Layers for Advanced Downstream Application Field
Suntek Contract Factory:
Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC
assembly,Cable assembly,Mix technology assembly and Box-buildings.
Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;
BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.
Capabilities overview:
Product Name | PCB Assembly |
PCBA Test | AOI, X-RAY, ICT, Function Test |
PCB Assembly Method | BGA |
Minimum Hole Tolerance | ±0.05mm |
Layers | 2-10 |
PCB Thickness | 0.2-7.0mm |
Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
PCB Process | Immersion Gold |
PCB Quality System | ROHS |
Min. Line Width/Spacing | 0.1mm |
Surface Finish | ENIG |
Communication is the most important downstream application field of PCB. PCB has a wide range of applications in various aspects such as wireless network, transmission network, data communication and fixed network broadband, and it is usually added value such as backplane, high-frequency high-speed board, and multi-layer PCB board. Higher product. 5G is the next generation mobile communication network, and there will be a large amount of infrastructure construction demand by then, which is expected to greatly boost the demand for communication boards.
Here are the most common applications of the telecommunication industry that make efficient use of PCBs:
While special substrates like polyimides and ceramics handle wider temperature swings, FR-4 laminates have evolved “high Tg” versions usable to 150°C+ along with lower cost and better fabricator familiarity. So FR-4 remains an option for many industrial applications not hitting extreme temps.