Suntek Electronics Co., Ltd.

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Immersion Gold PCB Assembly for RCC Build-up Material Achieve 0.2mm 8mil Min Hole Size

Immersion Gold PCB Assembly for RCC Build-up Material Achieve 0.2mm 8mil Min Hole Size
  • Immersion Gold PCB Assembly for RCC Build-up Material Achieve 0.2mm 8mil Min Hole Size
  • Immersion Gold PCB Assembly for RCC Build-up Material Achieve 0.2mm 8mil Min Hole Size
  • Immersion Gold PCB Assembly for RCC Build-up Material Achieve 0.2mm 8mil Min Hole Size
  • Immersion Gold PCB Assembly for RCC Build-up Material Achieve 0.2mm 8mil Min Hole Size
Products Detailed
Capabilities overview: Layers: Rigid PCB 2 - 40 + Layers, Rigid-flex PCB 1 - 10Layers Panel Size(max): 21" x 24" PCB Thickness: 0.016" to 0.120" Line ...
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