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THT SMT Assembly Board High Efficiency Productivity Imm Gold BGA PCBA

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Suntek Electronics Co., Ltd.
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City:changsha
Province/State:hunan
Country/Region:china
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THT SMT Assembly Board High Efficiency Productivity Imm Gold BGA PCBA

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Brand Name :Suntek
Model Number :SRIF0326RI
Certification :ISO9001, ISO13485, TS16949 and UL E476377
Place of Origin :China/Cambodia
MOQ :5pcs
Price :USD+1-100+PCS
Payment Terms :T/T,Paypal
Supply Ability :100pcs/hour
Delivery Time :1 week after all components collected
Packaging Details :60*40*30cm cartons and ESD bags
Material :FR4 TG130 TG170 TG180
Color :Red,Green,Black,Purple,White
Layer :1-30L
Size :100*200mm,1200*400mm,200*400mm
Surface Finishing :Electroplate Ni/Au(Flash gold/Soft gold/Hard gold), ENIG, HASL, Immersion Tin,OSP
package :0201 0603 0805 2410 BGA QFN DFN
Test :AOI,ICT,100% Visual Inspection,FT
Blind or Buried Vias :Yes
Impedance Control :Yes
Copper thickness :8 OZ
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OEM ODM PCB Assembly board High Efficiency Productivity Imm Gold With BGA

We have advanced manufacturing equipments,professional technology, professional engineer team,purchasing team,quality team and well trained operators to make sure the PCB assembly product with good&stable quality.

SMT Parameters:

Technology Circuit PCB/Flex/Metal PCB/Rigid-Flex Parameter Assembly Side Single/Double
Process SMT Min Size 10mm * 10mm
THT Max Size 410mm * 350mm
Punch Thickness 0.38mm ~ 6.00mm
In-circuit Test Function Test Min Chip 0201 chip
Glue,Burn-in Conformal Coating Fine-pitch 0.20mm
BGA Re-work BGA ball size 0.28mm

Technology Involved:

Item Capability
Min.Finished Board Thickness 0.05mm
Max Board Size 500mm*1200mm
Min Laser Drilled Hole Size 0.025mm
Min Mechanical Drilled Hole Size 0.1mm
Min. Trace Width/Spacing 0.035mm/0.035mm
Min.Annular Ring of Single/Double-side Board 0.075mm
Min.Inner Layer Annular Ring of Multi-layer Board 0.1mm
Min.Outer Layer Annular Ring of Multi-layer Board 0.1mm
Min Coverlay Bridge 0.1mm
Min. Soldermask Opening 0.15mm
Min.Coverlay Opening 0.35mm*0.35mm
Min Single-ended Impedance Tolerance +/-7%
Min Differential Impedance Tolerance
Max Layer Count 12L
Material Type PI,Kapton
Material Brand Shengyi,Taiflex,Thinflex,ITEQ,Allstar,Panasonic,Dupont,Jiujiang
Stiffener Material Type FR4,PI,PET,Steel,AI,Adhesive Tape,Nylon
Coverlay Thickness 12.5um/25um/50um
Surface Finish ENIG,ENEPIG,OSP,Gold Plating,Gold Plating+ENIG,Gold Plating+OSP,Imm Silver,Imm Tin,Plating Tin

Special Technology Involved:

◆ IC Programming

◆ BGA rework

◆ Chip on Board/COB

◆ Eutectic soldering

◆ Auto-Gluing

◆ Conformal Coating

THT SMT Assembly Board High Efficiency Productivity Imm Gold BGA PCBA

Assemly Flow Chart:

THT SMT Assembly Board High Efficiency Productivity Imm Gold BGA PCBA

THT SMT Assembly Board High Efficiency Productivity Imm Gold BGA PCBA

Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC assembly,Cable assembly,Mix technology assembly and Box-buildings.
Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;
BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.With ISO9001:2015,ISO13485:2016,IATF 16949:2016 and UL E476377 certified,.We deliver qualified products with competitive price to clients all over the world.

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