Suntek Electronics Co., Ltd.
Quality Wins Market,Ideas Creat the Future!
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2mm PCB Assembly for New Energy products with RoHs and ISO9001 certified
A Contract Electronics Manufacturing Services Provider
Suntek Capability:
| Quality Grade | Standard IPC 2-3 |
| Assembly Technology | • SMD Stencils •PCB Fabrication • SMT PCB Assembly • THT assembly • Cable and Wire Harness Assembly • Conformal Coating • Box Build Assembly • Final product assembly |
| Value Added Services | • Component Sourcing • Packing and delivery • DFM • Packing and delivery • PCBA sample • Rework • IC Programming • NPI Report |
| Company Certifications | • ISO9001 • IATF16949 • ISO13485 • UL |
| Order Capacity | • No requirements of MOQ (Minimum Order Quantity) |
| Testing Process | • QC manual inspection • SPI(Solder Paste Inspection) • X-ray • FAI(first article inspection) • ICT • FCT • Aging test • Reliability test |
One-Stop Solution EMS Service:
| OEM service | |||
| Layers | 1-32 Layers | Copper weight | 0.5 oZ~10 oZ |
| Material | FR4(Tg 135-Tg180) 94v0,Rogers,Aluminum | Board cutting | Shear,V-score,tab-routed |
| Board type | Rigid, flexable, rigid-flexable | Silk screen | Single double-sided green LPI etc |
| Board shape | Rectangular,round,slots,cutouts etc | Design file format | Gerber, CAD,.BRD |
| Board Thickness | 0.2~5.0mm,Flex 0.01~0.25“ | Bom format | Excel,PDF |
PCB Assembly
1)Our Equipments include Desen Printing press,Samsung SMT, JT lead-free re-flow ovens,
lead-free wave-soldering,BGA rework base,AI machine.
2) Surface mount,through-hole,BGA,QFP and QFN,0201 parts assembling.
3) AOl testing(X-ray for BGA package) for every piece board.
4)First article inspection before SMD process and First completed sample before DIP process.
5)Programming and function testing .
6)Conformal coating and Glue
PCBA/Wire Harness/Box build Quality System:
PCB Assembly equipments: