Suntek Electronics Co., Ltd.
Quality Wins Market,Ideas Creat the Future!
Add to Cart
Red,Green,Black,Purple,White Soldermask with PVC Cable ENIG 2U Surface Finish OSP 0.5-0.5um
SMT Parameters:
| Technology | Circuit | PCB/Flex/Metal PCB/Rigid-Flex | Parameter | Assembly Side | Single/Double |
| Process | SMT | Min Size | 10mm * 10mm | ||
| THT | Max Size | 410mm * 350mm | |||
| Punch | Thickness | 0.38mm ~ 6.00mm | |||
| In-circuit Test Function Test | Min Chip | 0201 chip | |||
| Glue,Burn-in Conformal Coating | Fine-pitch | 0.20mm | |||
| BGA Re-work | BGA ball size | 0.28mm |
Technology Involved:
| H 高 | ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT | ◆SMT machine(for printing,pick place,reflow soldering) ◆THT machine(for wave soldering) ◆Terminal machine... | ◆AOI ◆X-RAY ◆injection molding machine ◆AI(Automatic Inserting machine)... |
| M 中 | ◆SMT+ICT ◆THT+FT ◆SMT+THT ◆THT+Harness+FT ◆Assembly+FT | ◆ Genera SMD+DIP ◆ DIP parts+ Harness ◆SMD+DIP+Harness without injection molding | ◆≤0201 SMD ◆BGA,LGA,FBGA,LCC+LGA ◆Harness+injection molding ◆Conformal coating |
| S 低 | ◆纯SMT(Only SMT) ◆纯THT(Only THT) ◆纯线束(Only Harness) ◆纯组装(Only Assembly) | ◆代工代料 Material+ Assembly | ◆设计+代工代料 Design+Meterial+Assembly |
| low | higher | highest |
Special Technology Involved
◆ IC Programming
◆ BGA rework
◆ Chip on Board/COB
◆ Eutectic soldering
◆ Auto-Gluing
◆ Conformal Coating
Assemly Flow Chart:
We provide EMS one-stop solution for our customers:
※ PCB, Flex, Rigid-flex, MPCB,HDI bare board
※ Surface Mount Assembly (SMT)
※ Through Hole Technology (THT)
※ Ball Grid Array (BGA) assembly and inspection
※ Wire harness & cable assembly
※ Box Build and Final assembly
※ Lead-Free,RoHS,Reach compliance
※ Conventional / mixed technology assembly
※ High-mixed/Low & Mid volume supporting
※ Full / part procurement of material
Alliance with global electronic suppliers
※ Assembly from customer consiged material
※ Product test (ICT and functional)
※ Full turnkey & Consign business supporting